Book†
Paper (reviewed journal)†
- T. Nagase, T. Tamura, Materials Transactions, accepted, "Solidification Microstructures in 3d-Transition Metal High Entropy Alloys with Cu Element", https://doi.org/10.2320/matertrans.MT-D2023002
Review paper†
Proceeding (referee reading) †
Proceeding (No referee reading)†
Reports†